Finetech manufactures and supplies sub-micron accuracy die bonders for die attach, advanced packaging, and micro assembly applications. Manual, semi-automatic motorized, and automated models provide a prototype to production pathway. High process flexibility within one platform allows a wide range of bonding technologies: thermo-compression, ultrasonic, eutectic, epoxy, sintering, ACF/ACP, Indium, and precision vacuum die bonding. Application areas covered include optical packages, sensors, si photonics, micro LEDs, Cu pillar, flip chip, chip-on-glass, chip-on-flex, package on package, MCM, MEMs and more. Finetech also offers precision dispensers and advanced rework systems for today's challenging applications. The extensive process knowledge of Finetech’s engineering team significantly enhances the value of our solution offering. In an industry where "one size" does not fit all, Finetech engineers collaborate closely with customers to devise customized solutions for their specific applications. Ask us about our newly integrated PLASMA CLEANING solution, ideal for sensor and hybrid bonding.