Mosaic is a leading domestic provider of glass advanced packaging for microelectronics. Mosaic's glass substrates and interposers address evolving trends, offering increased interconnect density compared to organic interposers and with lower loss than silicon. Moreover, the burgeoning innovations in AI, chiplets, and heterogeneous integration are catalyzing a revolution in advanced semiconductor packaging. Mosaic's glass, characterized by its smooth surface enabling finer feature patterning and smaller vias, empowers designers to optimize performance, minimize power consumption, and enhance design flexibility.