Silitronics offers IC package design, substrate fabrication, process development and assembly services. We are the only company to provide fully automated active alignment for Silicon Photonics, FAU design + fabrication and co-package optical assembly for AI/ML, Cloud, LiDAR and Silicon Photonics customers. Silitronics has fully automated equipment in a clean room 10K and 1K with ISO9001, ISO13485, ITAR and Mil-Std883 quality controls. Silitronics team has expertise to innovate, develop, and implement cost effective design and assembly solutions from concepts to finished products. Our key differentiated services are complicated process development and full turn-key services. Many of the NPI are so advanced that there is no precedence and does not fit in a standard assembly. Often the design rules have to be pushed beyond its limit. This requires development of test vehicles, identification of right material sets, careful process control, monitoring of assembly parameters through well planned Design of Experiments (DOE) and investments in new equipment. Silitronics customer are top tier hyper scalers and leading start-ups in Chiplets Heterogeneous Integration, Silicon Photonics, COB, MEMS sensors, LiDAR, AR/VR, and Defense applications. Silitronics team has 100+ man years of R&D experience. For any questions: call at 408-605-1148 or email to:sales@silitronics.com.