Intlvac Thin Film

Booth Number: 1816

Descriptions:

"At Intlvac Thin Film, we specialize in advanced thin film deposition systems designed to meet the demanding needs of the MEMS, semiconductor, and display industries. With years of expertise and innovation, we deliver cutting-edge solutions for precision coatings and high-performance materials.

Our flagship product, the Icarus Indium Solder Bump Deposition System, is engineered for high-throughput production with minimal maintenance and fast turnaround times. Optimized for indium thin film deposition, the system offers industry-leading features such as advanced thermal process control (+60°C to -75°C), uniform film deposition, and a high-yield lift-off process. The Icarus supports hundreds of depositions without requiring chamber access, ensuring efficiency and reliability for high-volume manufacturing.

We leverage Physical Vapor Deposition (PVD) methods to produce superior thin films, offering better adhesion, uniformity, and density compared to other deposition techniques. PVD also provides precise control over coating thickness, making it ideal for applications in semiconductor devices, microprocessors, and integrated circuits. Our proprietary processes ensure ultra-purified indium deposition, eliminating common challenges like ""spitting"" and delivering high-quality morphology for solder bumps used in flip-chip bonding and advanced microelectronic packaging.

Flip-chip bonding, integral to modern microelectronics, is a key focus of our expertise. This advanced technique directly connects the active area of the die to the substrate using solder bumps, arranged in an array across the surface. By minimizing signal path lengths, flip-chip bonding reduces electrical resistance, enhances speed, and improves thermal conductivity through efficient heat dissipation pathways—essential for high-frequency and high-density applications. These benefits make it a preferred method for advanced semiconductor devices, microprocessors, and compact, high-performance device assembly.

Whether you’re developing next-generation semiconductor devices or exploring innovative MEMS and display solutions, Intlvac Thin Film offers complete, reliable systems and unmatched expertise to meet your unique needs. Let us help you push the boundaries of what’s possible in microelectronics."

Contact us:

Website: https://intlvac.com/