Wednesday, May 2025

03:30 PM - 03:50 PM

Room: 220C

Session: Ultra-High Bandwidth for AR/VR/MR

A Multi-Drop High-Speed Link with Foveated Up-Scaler to Reduce Wires and Data Bandwidth in LED-on-Silicon-Backplane for AR Glasses

Invited

• Hyun-Wook Lim

  Samsung Electronics

Description:

This paper presents a multi-drop high-speed link of micro LED-on-Silicon (LEDoS) display with upscaling and foveation for AR glasses. By utilizing multi-drop connection of MIPI C-PHY, number of wires between host and LEDoS display module could be reduced from 36 to 6 wires with 1 trio per each left and right eye for data transmission. In order to maximize sampling timing margin, self-calibrated sampling phase is proposed regardless of jitter induced by multi-drop channel. Additionally, foveation upscaling technique is proposed to reduce total data bandwidth, and as a result, a 1.5Gsps MIPI C-PHY single trio can be used to transmit 3.5Gbps for AR glasses application. A silicon backplane is fabricated in a 28nm CMOS process and verified up to 2.0Gsps per trio in the MIPI C-PHY on multi-drop channel.