Thursday, May 2025
01:30 PM - 01:50 PM
Room: LL21CD
Session: Micro LED Display Manufacturing Heterointegration
Laser-Assisted Bonding for MicroLED Modules in Head-Up Display Applications
Description:
Metal interconnect technology between the Micro-LED chip and the substrate has become a critical bottleneck, with the mass transfer process widely regarded as the main technical hurdle in commercializing displays. Testing and characterization comparing eutectic solder joints with ACF bonding modules have demonstrated the photoelectric efficiency of metal eutectic display modules has increased by 51.3%. A 3.8-inch, 1280×1024 ultra-high-resolution, ultra-high-brightness HUD display module has been developed by laser-assisted bonding technology, achieving a lighting yield of over 99.9%. These performance and technological advantages have further accelerated the commercialization of Micro-LED display technology.