Friday, May 2025

09:00 AM - 09:20 AM

Room: LL21AB

Session: Glass-Based Semiconductor IC Packaging for Chiplet Integration

Preparation Process of Through-Glass Via Based on Laser-Induced Deep Etching

• Dong Ming Xing

  Beijing BOE Sensor Technology Co., Ltd.

Description:

In this paper, the process of preparing through glass via (TGV) by laser induced deep etching(LIDE) was studied, the TGV prepared by laser induced deep etching was characterized and analyzed, the relationship between glass characteristics and TGV properties was explored, the influence mechanism of wet etching process on TGV morphology was analyzed?and the characterization standard of TGV was established.