Friday, May 2025
11:00 AM - 11:20 AM
Room: LL21AB
Session: Packaging Strategies for Advanced Displays
Cutting-Edge Laser Forming in High-Precision Hole Fabrication for Thin Glass Applications
Description:
We demonstrate a novel laser forming technique for precise hole fabrication in thin glass substrates. Using controlled heat gradients and stress dynamics, interior holes are generated within 0.5 seconds with sub-5 µm average chipping and no heat-affected zone. This high-precision process enables scalable solutions for advanced applications, such as high-resolution OLED displays, requiring small-diameter holes in thin glass with minimal thermal and structural damage.