Thursday, May 2025

01:50 PM - 02:10 PM

Room: LL21CD

Session: Micro LED Display Manufacturing Heterointegration

Adhesion Mechanism of Ni-Au and Cu Layer in Electro-Less Nickel Immersion Gold Process for Chip-on-Glass MLED Backplane

• Ting Zeng

  HeFei BOE RuiSheng Technology Co., Ltd.

Description:

Researching on mechanism of insufficient adhesion between Ni-Au and Cu layer was using for improving product yield and reliability for chip on glass (COG) MLED backplane. The main factors are the Cu surface cleanliness before electro-less nickel immersion gold process (ENIG) and the Cu/Ni interface voids influence during the ENIG process. Therefore, the adhesion problem can be solved completely by adjusting the backplane process.