Friday, May 2025
02:10 PM - 02:30 PM
Room: LL21AB
Session: mmWave Systems Integration and Advanced Chiplet Packaging on Glass
Multilayer Glass Structure for Advancing Packaging and Substrate Technologies
Invited
Description:
The rapid societal implementation of artificial intelligence has led to a significant increase in power demand, creating pressing challenges in energy efficiency. Simultaneously, the realization of a low-latency network society necessitates advanced technologies capable of high-speed and large-scale data transmission. While efforts to maximize performance per watt have driven the development of high-density chip integration, traditional organic substrates are reaching their mechanical and electrical limitations.