Friday, May 2025

09:40 AM - 10:00 AM

Room: LL21AB

Session: Glass-Based Semiconductor IC Packaging for Chiplet Integration

Large Scale Glass Substrate for High Performance Computing Application

Invited

• Satoru Kuramochi

  Dai Nippon Printing Co., Ltd.

Description:

As the industry moves toward High Performance Computing(HPC) for huge data transmission with low power consumption. The requirements for PKG structure have become more challenging. The major engineering requirements for HPC application are high-density, high-speed data transmission, low loss, precision manufacturing with low-cost process. High pin count need large area package with high mechanical stability and low warpage.