Friday, May 2025

10:00 AM - 10:20 AM

Room: LL21AB

Session: Glass-Based Semiconductor IC Packaging for Chiplet Integration

Glass Substrates and Interposers: Wafer and Panel Scale Manufacturing Processes and Applications

Invited

• Venky Sundaram

  3D System Scaling LLC

Description:

Advanced packaging is driving the future of system scaling, in bandwidth, power delivery, reliability, and cost. Glass substrates have emerged as a transformative solution, at both wafer and panel scales, for 5G/6G, AI-HPC, and photonics applications. Global investments exceeding $1B have accelerated innovations in glass packaging, driven by the unique properties of glass. Glass substrate and interposer manufacturing has benefited from display, semiconductor and package/PCB innovations. This paper will summarize the evolution of key building blocks at wafer and panel scales, along with the outlook for glass packaging.