Wednesday, May 2025

04:30 PM - 04:50 PM

Room: 220B

Session: Novel uLED Display Systems

0.26-in. LED Microdisplay Using Pixel Level Cu-Cu Connections of Transferred GaN/Si and CMOS Backplane Wafer

Distinguished

• Haruki Tsuchiya

  Sony Semiconductor Solutions Corp.

Description:

We have developed an integration process for LED microdisplays toward AR applications. This process consists of Cu-Cu hybridization to connect heterogeneous materials; a die-to-silicon transferred GaN/Si wafer and a CMOS backplane wafer, followed by the fabrication of LED mesas and on-chip lenses. We report the key features and results of this process, and also present a prototype of 0.26-inch 5644 ppi LED microdisplay.