Friday, May 2025

02:30 PM - 02:50 PM

Room: LL21AB

Session: mmWave Systems Integration and Advanced Chiplet Packaging on Glass

Advanced IC Substrate Taking Advantage of Flat Panel Display Technology

Invited

• Kazuyuki Yamada

  Japan Display Inc.

Description:

The substrate for the advanced IC package now faces higher challenges such as more complex wiring or larger substrate size as IC and pin count gets increased. This paper introduces JDI's development activities regarding the advanced IC substrate which take advantage of the flat panel display manufacturing technology. It includes 5um/5um wiring and 4 copper layers on a support glass.