Friday, May 2025

03:00 PM - 03:10 PM

Room: LL21AB

Session: mmWave Systems Integration and Advanced Chiplet Packaging on Glass

Low-Thermal-Stress TGV Leadless Wafer-Level-Package for MEMS High-Temperature Pressure Sensors

Late-News

• Qiuxu Wei

  Beijing BOE Sensor Technology Company, Ltd.

Description:

Due to high insulation, low cost and low thermal stress of glass wafer, glass is considered as a promising material for advanced package in MEMS sensor. In this paper, a low-thermal-stress Silicon on insulator high temperature pressure sensor was developed by using TGV interconnect technology and glass-based wafer-level packaging technology.